发明名称 |
CAPACITOR AND FABRICATING METHOD OF THE SAME |
摘要 |
PURPOSE: A method of fabricating a capacitor is provided to increase an effective area and capacitance by forming a hemispherical grain in a cylindrical capacitor and on a top surface thereof. CONSTITUTION: The method comprises the steps of etching a first insulating layer formed on a semiconductor substrate to form a storage node contact hole; filling the storage node contact hole with conductive material to form a storage node contact plug; forming a second insulating layer on the first insulating layer and the storage node contact plug; partially etching the second insulating layer to form an opening exposing a top surface of the storage node contact plug and a part of the first insulating layer at both sides of the storage node contact plug; forming a polysilicon layer on the second insulating layer to partially fill the opening; forming a photoresist layer on the polysilicon layer to fill up the opening; plainly etching the polysilicon layer and the photoresist layer at both sides of the opening down to a top surface of the second insulating layer; removing the photoresist layer in the opening; forming a hemispherical grain polysilicon layer on an internal surface and a top surface of the storage node; and removing the second insulating layer at both sides of the storage node down to a top surface of the first insulating layer.
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申请公布号 |
KR20000007542(A) |
申请公布日期 |
2000.02.07 |
申请号 |
KR19980026920 |
申请日期 |
1998.07.03 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
BAEK, IN GI |
分类号 |
H01L27/108;(IPC1-7):H01L27/108 |
主分类号 |
H01L27/108 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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