This is a device package comprising: a leadframe 54 comprising a plurality of leads for effecting circuit connections to a device 30; and a metal ground piece 52 connected to the leadframe 12. Other devices and methods are also disclosed. <IMAGE>
申请公布号
DE69326112(T2)
申请公布日期
2000.02.03
申请号
DE1993626112T
申请日期
1993.10.26
申请人
TEXAS INSTRUMENTS INC., DALLAS
发明人
NELSON, STEPHEN R.;DAVIS, DENNIS D.;BARNETT, JOHN;CARTER, BUFORD H.;LAHUTSKY, TAMMY J.;HAAS, GLEN R.
