| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of reducing focusing errors in an exposure process for a semiconductor device. SOLUTION: A method of reducing focusing errors in an exposure process of a semiconductor device comprises a first step, where a wafer 102 which contains semiconductor integrated circuit chips that include one or more layers respectively is provided, a second step where a conductive film 122 that is kept in ohmic contact with a peripheral region, where semiconductor integrated circuit chips are not provided is provided to the wafer, and a third step where the topology of the wafer is measured with a capacitance gate tracking device, before an exposure process is carried out. |
