发明名称 MANUFACTURE OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a coil part as an electronic component which is high in quality, free of connection failures, and low in price. SOLUTION: A manufacturing method is carried out through a manner, where vibrations are given by vibration applying means 11A and 11B to the edge faces of the core 1 of a coil part which functions as a passive device, and lead terminals 4a and 4b are connected with conductive adhesive materials 8a and 8b liquidized through vibration. With this constitution, projected objects so-called 'horns' generated due to the thixotropic properties of the conductive adhesive materials 8a and 8b are restrained from being produced, and the lead terminals 4a and 4b are connected satisfactorily kept free of connection failures, so that an electronic component which is high in quality and low in price can be provided.
申请公布号 JP2000036427(A) 申请公布日期 2000.02.02
申请号 JP19980205529 申请日期 1998.07.21
申请人 TDK CORP 发明人 KOTANI TSUTOMU;KOBAYASHI KAZUMI;YOSHIDA RYUJI
分类号 H01F41/10;(IPC1-7):H01F41/10 主分类号 H01F41/10
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