摘要 |
A device includes a chip (111), and a resin package (112, 151, 314) sealing the chip, the resin package having resin projections (117, 154, 318) located on a mount-side surface of the resin package. Metallic films (113, 155, 315) are respectively provided to the resin projections. Connecting parts (118, 101, 163, 245, 313, 341, 342) electrically connect electrode pads of the chip and the metallic films. <IMAGE> |
申请人 |
FUJITSU LIMITED |
发明人 |
YONEDA, YOSHIYUKI;TSUJI, KAZUTO;ORIMO, SEIICHI;SAKODA, HIDEHARU;NOMOTO, RYUJI;ONODERA, MASANORI;KASAI, JUNICHI |