发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To position in laminating even without using a hanging pin by bringing a jig into contact with a plurality of end faces of a lead frame having a corner or a recess exposed from a molding resin except outer leads. SOLUTION: When a lead frame is resin sealed, an inside of a package hanging lead is sealed in a resin, and a laminating positioning lead 4 is partly exposed. In the frame, the resin is formed, and resin burr occurs at an inside of a tie bar. When the burr occurs at the inside of the lead, a positioning accuracy at the time of laminating is deteriorated, and hence a structure in which no resin burr occurs at the inside of the lead 4 is formed. A laminating jig 11 is formed in a protrusion state to be mated to a recess shape of the lead 4. Since the lead 4 having a region of no burr and the jig 11 can be positioned when laminated, accurate positioning can be executed.
申请公布号 JP2000036559(A) 申请公布日期 2000.02.02
申请号 JP19980204683 申请日期 1998.07.21
申请人 HITACHI LTD 发明人 YOSHIDA ISAMU;AMANO YASUO
分类号 H01L23/28;H01L23/50;H01L25/10;H01L25/11;H01L25/18;(IPC1-7):H01L23/50 主分类号 H01L23/28
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