发明名称 RESIN COMPOUND FOR CASTING AND ITS USE
摘要 PROBLEM TO BE SOLVED: To obtain a resin compound for casting capable of providing a compound material having temperature stability, slight strain in a large area and dimensional stability by including a glycidyl ether-containing resin and an epoxy resin having another specific structure. SOLUTION: This resin compound for casting comprises (A) a glycidyl ether- containing resin and (B) an epoxy resin having at least one different biphenylene structural element and/or dicyclopentadiene structural element. The amount of the component B mixed is preferably 10-70 pts.wt. For example, bisphenol A-diglycidyl ether as the component A in an amount of 50 pts.wt. is incorporated with 50 pts.wt. of the epoxy resin component having a biphenyl structural element or an epoxy resin component having a dicyclopentadiene structural unit as the component B to give the objective composition. Consequently the compound is effectively usable for an electronic part, a sensor, a printed-wiring board, etc.
申请公布号 JP2000034394(A) 申请公布日期 2000.02.02
申请号 JP19990126093 申请日期 1999.05.06
申请人 SIEMENS AG 发明人 HOEHN KLAUS;LEHNER BARBARA;WIPFELDER ERNST
分类号 H01L23/29;C08G59/32;C08G59/42;H01L23/31;H02G15/00;H05K3/28;(IPC1-7):C08L63/00;B05D7/24;C08G59/06;C08G59/20;C08G59/58 主分类号 H01L23/29
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