| 摘要 |
<p>An organic resin multi-layer wiring substrate comprises a plurality of lamination blocks with a plurality of holes. Each lamination block is made by alternately laminating a plurality of electrically conductive wiring layers and insulation layers of organic resin. The holes penetrate the insulation blocks and also electrically interconnect the lamination blocks. A method of making an organic resin multi-layer wiring substrate comprising the steps of forming a plurality of lamination blocks (1,2) by alternately laminating a plurality of electrically conductive wiring layers (13a, 13b, 23a, 23b) and insulation layers (15, 26) of organic resin on hard plates (10, 20), adhering the two lamination blocks with the laminated layers abutting against each other, removing the hard plate (10) of one of the lamination blocks using appropriate solvent, and forming holes (3) through the one lamination block and extending into the other lamination block. <IMAGE></p> |
