| 摘要 |
PROBLEM TO BE SOLVED: To provide a high reliable semiconductor device capable of protecting a packaged semiconductor element by suppressing the advancement of cracking by stress. SOLUTION: A semiconductor device is composed of a packaged specific electronic element equipped with outer connecting leads 2b on one end side and a lead frame 2 to be fixed on the other end side in the case of fixing to an outer equipment and then resin sealed. At this time, a riser part 4 bent by a specific angle is to be provided at least at an opposing part to a packaged electronic part 5 on one end side of the lead frame 2. |
