发明名称 PLATE HEATING DEVICE
摘要 PROBLEM TO BE SOLVED: To accurately control the temp. of an object in thin plate form using the obtained temp. measurements by heating the object by electron bombardment from behind, measuring the temp. of the object from behind where a filament for electron bombardment is installed, and preventing a temperature rise in measurement due to electron bombardment of a temp. measuring element at measuring the temp. SOLUTION: A plate heating device is composed of an object support member 1 with heat resistance including a flat heating part 2 on which an object (a) in thin plate form is placed, a filament 9 installed in a space behind the heating part 2 and generating thermions, an electron accelerating power supply 11 for accelerating the generated thermions to bombard the heating part 2, and a reflector 3 which reflects the radiation heat emitted from the heating part 2 and is arranged independently of the filament 9 and heating part 2 in the electric terms. Further a thermocouple 12 arranging measuring points in the space behind the heating part 2 is provided, and a cylindrical shield 15 held at the same potential as the reflector 3 is installed in such a way as surrounding the thermocouple 12 and its measuring points.
申请公布号 JP2000036370(A) 申请公布日期 2000.02.02
申请号 JP19980203581 申请日期 1998.07.17
申请人 SUKEGAWA ELECTRIC CO LTD 发明人 WATANABE FUMIO
分类号 G01K7/02;H05B1/00;H05B3/00;H05B3/04;(IPC1-7):H05B3/00 主分类号 G01K7/02
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