| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate heating device which is capable of minimizing the degradation of transistor characteristics due to overheating and lessening costs and the consumption of electric power. SOLUTION: A substrate heating cassette 3 is provided with a heater 5 in the middle in the vertical direction between two upper and lower partition plates 4, and space between the upper side partition plate and the heater, and space between the heater and the lower side partition plates are provided with several stages of heating treatment parts 7, which are formed with a first slot S1 and a second slot S2 provided with respective substrate mounting parts 6.
|
