| 摘要 |
PROBLEM TO BE SOLVED: To reduce characteristic variation in oscillation frequency, etc., after the unit is fitted to a motherboard as compared with characteristics of the oscillation frequency before the unit is fitted to the motherboard. SOLUTION: This unit has a multi-layered substrate 21, a circuit component 10 fitted onto the top surface of the multi-layered substrate 31, a microstrip line 9 formed in the internal layer of the multi-layered substrate 31, and a through-hole 32 which is bored in the multi-layered substrate 31 and connects the circuit component 10 and microstrip line 9 to each other, a conductor wall 32a is formed in the through-hole 32, and the microstrip line 9 is connected to the conductor wall 32a; and the through-hole 32 is filled with resin 36, an electrode 32 b is formed on only one end surface of the resin 36, and the circuit component 10 is fitted onto the electrode 32b. |
