发明名称 SURFACE TREATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a surface treating device capable of uniformly subjecting plasma treatment to a substrate of a large area at a high speed. SOLUTION: Casing 2 is divided into two chambers of a plasma generating chamber 3 provided with plasma generating electrodes 5 and 5' and a substrate treating chamber 4 provided with a substrate supporting stand 8. On the electrode 5' composing the partition between the chambers 3 and 4, a plurality of plasma blow-off ports 6 are formed. Since this plasma blow-off ports 6 have opening width dimensions (d) at the parts satisfying 1 >= the dimensions (L) in the plasma blow-off directionthe minimum cross-sectional areas and also have nozzle shapes satisfying the area of the partition, i.e., the total Sn of the minimum cross-sectional areas of the plasma blow-off ports 6/the area Sp of the electrode 5'<=1/3, plasma is uniformly blown off from all blow-off ports 6.
申请公布号 JP2000034571(A) 申请公布日期 2000.02.02
申请号 JP19980201395 申请日期 1998.07.16
申请人 KOMATSU LTD 发明人 KOUSHIRI MASAYUKI;ISHIDA KOICHI;TABUCHI TOSHIHIRO
分类号 C23C16/50;H01L21/205;H01L21/31;(IPC1-7):C23C16/50 主分类号 C23C16/50
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