发明名称 SUBMINIMUM WIRING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a fuse capable of electrically fusing off at ordinary operational power supply voltage, and also customizing duplication or other circuits at module level as well as fusing method. SOLUTION: Semiconductor fuse is provided between conductors 20 for connecting at least two wirings. This fuse contains spacers 30 arranged on adjacent conductors 20 and a fuse element 31 connected to the wirings 22 arranged between the spacers 30. The space between the conductors 20 contains the first width containing the minimum possible photolithographic width while the fuse element 31 is in the second width narrower than the first width.
申请公布号 JP2000036566(A) 申请公布日期 2000.02.02
申请号 JP19990148674 申请日期 1999.05.27
申请人 INTERNATL BUSINESS MACH CORP <IBM> 发明人 RUI RU CHEN SUU;MANDELMAN JACK ALLAN
分类号 H01L27/04;H01H85/00;H01L21/60;H01L21/768;H01L21/82;H01L21/822;H01L21/8242;H01L23/525;H01L23/528;H01L27/06;(IPC1-7):H01L27/04 主分类号 H01L27/04
代理机构 代理人
主权项
地址