| 摘要 |
PROBLEM TO BE SOLVED: To completely resin a pull-out hole formed at the resin sealing body of a resin sealing type electronic part. SOLUTION: This is constituted of a supporting board 2 to which a semiconductor chip 7 is fixed, resin sealing body 17 surrounding the supporting board 2, outside lead 3 arranged at one end side of the supporting board 2 and derived from one end of the resin sealing body 17, and supporting fine bar 4 extended from the other end of the supporting board 2 and broken inside the resin sealing body 17. In this case, the supporting thin bar 4 is pulled out, thermosetting resin, self-curing, or room temperature curing hole sealing resin 20 is adhered inside the pull-out hole 18 formed at the side face of the resin sealing body 17, and the pull-out hole 18 is closed by the hole sealing resin 20 so that the supporting board 2 can be completely sealed. Thus, it is possible to obtain a high insulating pressure-resistant resin sealing type electronic part in which the supporting board 2 to which the semiconductor element is fixed is completely covered by the resin sealing body 17.
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