METHOD FOR REINFORCING POLYIMIDE BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for reinforcing a polyimide board comprising an FPC(flexible printed circuit board) or FFC(flexible flat cable) by which the end part of FPC or FFC is reinforced rigidly, by adhering it in the soldering step and it can be easily peeled off from the FPC or FFC and which can be utilized at a low cost and gives no influence on electronic parts mounted to the FPC or FFC. SOLUTION: A photosetting adhesive sheet made of photosetting adhesive composition containing a composition made by combining a composition of 10-70 wt.% adhesive polymer and 90-30 wt.% cation polymerizing compound of 500 g or less containing optical cation polymerizing functional group of 1 mol with an effective amount of optical cation polymerizing agent is irradiated with a light, and it is temporarily adhered to a polyimide board when its adhesivity becomes 6 or lower in ball tack value of JIS Z 0237 (inclination 30 deg.).