| 摘要 |
PROBLEM TO BE SOLVED: To easily obtain an interlayer insulation film and a wiring protection film that have an accurate and high-density pattern, by applying voltage between a needle electrode and the metal surface of a substrate, by forming an electrolytic deposition product in a specific shape on the metal surface of the substrate, and by drying and heat-treating the product on the metal surface of the substrate. SOLUTION: An electrolytic deposition agent 130 is applied onto one surface of a substrate 110 consisting of metal in a specific shape by a liquid discharge part 120. After then, a needle electrode 140 is dipped into the electrolytic deposition agent 130, the electrolytic agent 130 is electrically connected to the needle electrode 140, furthermore, a specific voltage is applied between the catwhisker 140 and the board 110, and an electrolytic deposition product 135 is formed on the surface of the substrate by electrolytic deposition. Then, when the surface of the substrate where the electrolytic deposition product 135 is formed is washed, only the electrolytic deposition product 135 with a specific shape is obtained on the substrate. After this, the electrolytic deposition product 135 is dried and heat-treated, and the insulating film of the electrolytic deposition product 135 is created, thus obtaining a wiring board that can cope with the thinning and increased density of wiring and also multilayer interconnection. |
