发明名称 QUICK-CURING ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a quick-curing adhesive composition which is quick in exhibition of initial strength, excellent in permeation through an adherend, high in bonding strength after setting up and, in addition, excellent in water resistance. SOLUTION: A quick-curing adhesive composition comprisess (A) an aqueous solution or an aqueous dispersion containing (a) a water soluble polymeric compound having a carboxyl group and a hydroxyl group in the molecule and (b) an aqueous polymeric compound having at least one of a primary amino group and a secondary amino group in the molecule and (B) an aqueous solution or an aqueous dispersion containing (c) a water soluble aldehyde compound.
申请公布号 JP2000034460(A) 申请公布日期 2000.02.02
申请号 JP19980275901 申请日期 1998.09.29
申请人 NIPPON NSC LTD 发明人 YOROZU KO;KAMIKASEDA TAKESHI
分类号 C09J201/02;C09J201/06;(IPC1-7):C09J201/02 主分类号 C09J201/02
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