| 摘要 |
PROBLEM TO BE SOLVED: To simultaneously assemble a plurality of thin-film jumper connectors to a substrate, by moving the substrate to a coarse alignment position on the thin-film connector, by precisely aligning the substrate, and by lowering the substrate so that the substrate is physically brought into contact with the pad or soldering bump of the connector. SOLUTION: At thin-film jumper connector 20 is mounted to an alignment plate 10 with its face up, and a coarse alignment mark 24 of the jumper connector 20 is precisely matched to an alignment mark 14 of the alignment plate 10. The jumper connector 20 is retained at the alignment plate 10 by suction force being transferred via a suction hole 12, thus simultaneously jointing a number of parts to a substrate while a desired alignment state is maintained between the parts and/or the parts and the substrate, and also utilizing a standard flip-chip-bonding device for executing joint operation. |
