| 摘要 |
PROBLEM TO BE SOLVED: To connect a bump-less IC chip with the terminal of a circuit board at low costs, by using an anisotropic conductive bounding material, and to maintain the high operation stability of the IC chip. SOLUTION: A bump-less chip IC1 in which an organic insulating film 6 is formed on a passivation film 4 and a circuit board 10 are connected by an anisotropic conductive bonding material 20 including hard conductive particles 23, at least whose surfaces are metal in this bare chip mounting structure. It is desired that the hardness of the hard conductive particles 23 is 300 kgf/mm2 or more as compressed hardness K value.
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