| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject reprocessable encapsulant readily distributable in conformity with an automatic production process and useful for protecting a semiconductor device and a package metal coating from environmental corrosion and mechanical loss by including a specific allylated amide compound, a specified free radical initiator, etc. SOLUTION: This encapsulant contains (A) an allylated amide compound having a chemical formula represented by formula I [(m) is 0 or 1; (n) is 1-6; R9 is H, a 1-18C alkyl, a 1-18C alkenoxy or the like; X is an aromatic having a structure represented by formula II or the like; Q is a linear or a branched- chain alkyl, a linear or a branched-chain alkyloxy or the like having up to about 100 atoms in the chain], (B) a free radical initiator, (C) a curing initiator selected from the group consisting of a photoinitiator and a combination thereof (preferably the one selected from the group consisting of an anionic and a cationic initiators), (D) optionally one or more kinds of fillers and (E) optionally one or more kinds of bonding accelerators. |
