| 摘要 |
PROBLEM TO BE SOLVED: To form a fine circuit conductor, by overlapping a half-cured insulation layer and a multilayered material consisting of an extremely thin metal layer with a roughened surface and a carrier layer on a circuit board, and by heating and pressing the layers for laminating in one piece. SOLUTION: The unnecessary copper foil of a glass-cloth epoxy copper-clad laminate where copper foil is laminated onto both surfaces is eliminated by etching, a circuit conductor 19 is machined, and a circuit board 1 of an inner layer is manufactured. Then, copper foil 21 where one surface is subjected to oxidation treatment for roughening is used as a metal layer with a roughening surface. On the roughened surface of the copper foil 21 made of a multilayered material consisting of a carrier 203, an intermediate layer 202, and a copper foil 201 due to oxidation treatment, a semi-cured epoxy bonding layer 31 of an insulation layer is formed by applying epoxy resin varnish in that the boric acid aluminum whisker of filler is dispersed and by drying it. The epoxy adhesive sheet with a multilayered metal foil is overlapped so that the layer 31 is brought into contact with the circuit board 1, and is heated and pressed for laminating in one piece by specific lamination conditions as a board, thus manufacturing a multilayer interconnection board with a superior circuit formation property and excellent interlayer connection reliability. |
