| 摘要 |
PROBLEM TO BE SOLVED: To improve through-put, and to improve product yield by making this whole device compact by making narrow a space between substrates for non-processing. SOLUTION: An interface part 4 is provided with a wafer transfer chuck 30 for transferring a wafer for carrying in-and-out a wafer W with a carrier 1 placed on a carrying in-and-out part 2, and first and second attitude converting devices 31 and 32 having holding tools 20 for holding the plural wafers W received by the chuck 30 with prescribed intervals. The first and second attitude converting devices 31 and 32 are formed so that the attitude of the wafer W can be converted into a horizontal state and a vertical state, and that the wafer W held by one holding tool 20 can be arranged so as to be inserted between the wafers W held by the other holding tool 20 after relative movement to an attaching and detaching direction. The interface part 4 and a processing part 3 are provided with a wafer carrying chuck 18 for holding the plural wafers W held by the holding tools 20, and for carrying the plural wafers W to each processing unit 51-53 of the processing part 3. |
