| 摘要 |
PROBLEM TO BE SOLVED: To polish a workpiece with high precision by applying load of an upper surface plate on the workpiece equally. SOLUTION: This double face polishing device is provided with a carrier formed by providing a through hole in a thin and flat plate, an upper surface plate 14 and a lower surface plate 16 which polish a platelike workpiece arranged in the through hole of the carrier by moving relatively for the workpiece, a carrier turning motion mechanism which makes the carrier perform circular motion in which it does not rotate and turns and moves the workpiece held between the upper surface plate 14 and the lower surface plate 16 in this through hole, a spindle 90 which is provided with parallel shaft cores in the vertical direction so that parallelism of both polishing faces of the upper surface plate 14 and the lower surface plate 16 is kept at high precision and the upper surface plate 14 is held to apply load on the workpiece equally, whose lower end is fixed on a top face of the upper surface plate 14, and which hangs out and rotates the upper surface plate 14, and a lifting and lowering main body 94 which holds the spindle 90 through a bearing 92 so as to rotate and is provided so as to reciprocate in the vertical direction. |
