| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the generation of chip crackings and chippings at cracking, scribing and braking a wafer, and to improve the acquisition rate of a chip from the wafer. SOLUTION: In this manufacturing method, an adhesive sheet 2, for which ultraviolet setting adhesive material 2b is coated on the surface of a base material 2a, is stuck to the back surface of a wafer 1, the entire cross section of the wafer and the layer of the ultraviolet ray curing adhesive material 2b are cut and diced, and then the ultraviolet ray curing adhesive material 2b is set by having the adhesive sheet 2 irradiated with ultraviolet rays. It is immersed in an etching tank in the state in which the ultraviolet setting adhesive material 2b and the chip 3 laminated, obtained by dicing on the base material 2a and a distortion layer remaining on the cut surface of the chip 3 by dicing is removed. |
