发明名称 PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To obtain a printed wiring board which can be soldered with ease and stability while stable high-frequency characteristics are ensured. SOLUTION: One example of printed wiring board comprises a printed wiring board 41 on which a conductive pad 42 shaped like a square for common wiring is disposed and a circular conductive pad 43 for signal lines is placed inside the conductive pad 42. The pad 42 shaped like a square electrically couples through holes 44 in which leads for common wiring of a connector are inserted. Also, by forming the pad in the same shape as the connecting bottom of a connector to be mounted thereon, the pad and the connecting bottom of the connector can be coupled without clearance when the connector is soldered to the printed wiring board. As a result, since shielding is ensured from the connector up to the surface of the printed wiring board, degradation in high-frequency signals can be prevented.
申请公布号 JP2000036655(A) 申请公布日期 2000.02.02
申请号 JP19980204893 申请日期 1998.07.21
申请人 HEWLETT PACKARD JAPAN LTD 发明人 SHIMODA TOMOSUKE;SUGAWARA TERUO;YAGI TOSHIYUKI
分类号 H05K3/34;(IPC1-7):H05K3/34 主分类号 H05K3/34
代理机构 代理人
主权项
地址