发明名称 |
Device for handling wafers |
摘要 |
<p>The present invention provides a device for handling wafers with every group of more than one that is built in a cassette-less automatic wafer cleaning apparatus, wherein the group of wafers are washed at a time which does not require very high accuracy in positioning the wafers and may accommodate the wafers of any different diameters, the device for handling wafers (20) comprising: external hollow shafts (23) and internal shafts (24) inserted and freely slidable within the inside of the external hollow shafts (23); a drive mechanism, wherein each pair of the external hollow shafts (23) and the internal shafts (24) are movable in their respective opposed directions by the same distances with a timing belt (38) and a drive motor (36) for driving the timing belt (38); a pair of handling members (27), (28) respectively held fast at pairs of ends side by side of each pair of the external hollow shafts (23) and the internal shafts (24); and a plurality of supporting structures (31) holding the wafers provided on the respective opposed surfaces of handling members (27), (28). <IMAGE></p> |
申请公布号 |
EP0657919(B1) |
申请公布日期 |
2000.02.02 |
申请号 |
EP19940308815 |
申请日期 |
1994.11.29 |
申请人 |
SHIN-ETSU HANDOTAI COMPANY LIMITED |
发明人 |
KUDO, HIDEO;UCHIYAMA, ISAO |
分类号 |
B08B11/04;B08B3/04;B65G49/07;H01L21/304;H01L21/677;H01L21/687;(IPC1-7):H01L21/00 |
主分类号 |
B08B11/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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