发明名称 |
Manufacturing method for holding tray for chip components |
摘要 |
<p>A method for manufacturing a holding tray for chip components is provided in which residual stress in the elastic member does not affect accuracy in machining of the hole and a metallic mold is not required. The method for manufacturing a holding tray for chip components having a plurality of holding holes includes the steps of preparing a hard substrate including a frame portion, a flat board portion unitarily formed with the inner peripheral surfaces of the frame portion, and a plurality of through-holes formed on the flat board portion; forming an elastic member in a region surrounded by the frame portion of the hard substrate to cure it; and making therethrough holding holes smaller than the through-holes by means of laser machining at positions corresponding to those of the through-holes on the elastic member after curing of the elastic member.</p> |
申请公布号 |
GB2339568(A) |
申请公布日期 |
2000.02.02 |
申请号 |
GB19990015302 |
申请日期 |
1999.06.30 |
申请人 |
* MURATA MANUFACTURING CO LTD |
发明人 |
AKIRA * MIZOI |
分类号 |
H01C17/28;B23K26/38;H01G13/00;(IPC1-7):B65D73/02;H05K13/00;B23K26/00 |
主分类号 |
H01C17/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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