| 摘要 |
PROBLEM TO BE SOLVED: To make a light emitting element and a light receiving element small in thickness as much as possible, and make the incorporated module and set compact. SOLUTION: A semiconductor chip is provided as a light receiving element, and a resin packaging body 25 for packaging it is made of material which is transparent to light. Further, a groove 27 is formed in an area where a light enters the element, thereby forming a reflection surface 26. As a result, the light can enter and go out through a side surface E. Furthermore, a side surface S is adjusted by adjusting a curvature so that a focal point F is arranged on the right and left sides of the reflection surface, and a distance between the reflection surface and semiconductor chip is adjusted, thereby converging a light flux entering the side surface S. |
