PROCESSING METHOD AND DEVICE OF RESIN SEALED LEAD FRAME

摘要

PROBLEM TO BE SOLVED: To simply conform to the alteration to different kind of works in the case of working resin sealed leadframe. SOLUTION: Respective step parts required for lead processing of resin sealed lead frame are separately divided to modules for making a quick disconnectable composition. In such a constitution, respective modules (101-104) are properly connected or removed if necessary so that the lead processing device of the resin sealed lead frame provided with respective required step parts may be simply and rapidly composed.