| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a laminated semiconductor board where no oxide film is present by a method, wherein a natural oxide film is formed and is bonded stably on a bonding surface at a room temperature, and an oxide film present at a bonding interface is removed, when two semiconductor boards are laminated and bonded together into a laminated semiconductor board. SOLUTION: A laminated semiconductor board which is formed by bonding two semiconductor boards together and where no foreign object is present at a bonding interface is manufactured through a method in which two semiconductor boards 1 and 2 where a natural oxide film layer 3 is formed respectively are bonded together, the one surface of the bonded semiconductor boards 1 and 2 is grounded down and polished, and the bonded semiconductor boards 1 and 2 are heat treated in a nonoxidizing atmosphere at a prescribed temperature, where by a laminated semiconductor board 4 where no oxide film is present at a bonding interface can be formed.
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