Ultraviolet curing pressure-sensitive adhesive sheet

摘要

An ultraviolet curing pressure-sensitive adhesive sheet prepared by forming an ultraviolet curing pressure-sensitive adhesive layer on at least one surface of a substrate film and adhering a separator to the surface of the ultraviolet curing pressure-sensitive adhesive layer, wherein the separator has an ultraviolet transmittance at a wavelength of 300 to 400 nm of 65% or lower. The separator is obtained by forming a layer containing an ultraviolet absorber on the surface of the substrate film opposite the surface adhering to the pressure-sensitive adhesive layer or incorporating an ultraviolet absorber in the film. The ultraviolet curing pressure-sensitive adhesive sheet is useful as a semiconductor-protective pressure-sensitive adhesive sheet and a semiconductor wafer-fixing sheet, which can be used without causing a curing reaction with the exposure of a slight amount of ultraviolet rays from a surrounding environment at the standby for adhering wafers.