发明名称 PROCESS MODULE CONTROL DEVICE AND METHOD FOR SEMICONDUCTOR WAFER SPINNER SYSTEM
摘要 PROBLEM TO BE SOLVED: To enable a large number of coaters and developer units to be con trolled at the same time by a single control device. SOLUTION: Process data are inputted for controlling a unit through an input device driver 301, which receives a unit control instruction from a host system controller 297 and stored in a memory 302, the memory 302 is formed of a multi-process module memory, a process data analyzer 304 is provided so as to analyze and process the process data, and a message transfer 303 is arranged between the memory 302 and the process data analyzer 304, wherein the message transfer 303 receives and analyzes a unit control instruction from the memory 302 and transmits this analysis result and a device ID and a unit ID extracted from the process data analyzer 304 in a message form to the process data analyzer 304.
申请公布号 JP2000036455(A) 申请公布日期 2000.02.02
申请号 JP19990171499 申请日期 1999.06.17
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 KIN JINKI
分类号 H01L21/027;B05C11/08;G06F13/00;(IPC1-7):H01L21/027 主分类号 H01L21/027
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