| 摘要 |
A semiconductor device is provided which can improve a heat radiation characteristic of the package, and also can solve an uniform characteristic of ball sizes when a projection electrode such as soldering balls is formed by way of the electrolytic plating method. A semiconductor device is comprised of: a semiconductor chip in having a plurality of electrode pads and an inside of a pad forming region thereof used as an effective element region; a reinforcement plate provided under such a condition that this semiconductor chip is surrounded by the reinforcement plate; a plurality of leads constituted by an outer lead and an inner lead, in which a projection electrode is provided on the outer lead, and also a tip portion of the inner lead is connected to the electrode pads sealing resin filled into a peripheral region of the semiconductor chip. A conductor pattern is formed on the effective element region of the semiconductor chip; and the conductor pattern is covered by an insulating film to be protected; and further a projection electrode is provided on this conductor pattern.
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