Method of manufacturing ball grid array semiconductor package

摘要

Provided with a method of manufacturing a ball grid array semiconductor package using a flexible circuit board strip, which is directed to prevent minute conductive traces in the outer part of a circuit pattern formed in the flexible circuit board and thus minimize the short-circuits by forming notches on the flexible circuit board in the vicinity of the lower side ends of a resin encapsulant section by use of a punch, and pressing down the resin encapsulant section with a singulation tool to remove the carrier frame and separate the ball grid array semiconductor packages in the piece.