发明名称 THE METHOD OF HEAT TREATING OF LEAD FRAME
摘要 A method for forming a plating layer of a lead frame having excellent anti-corrosion properties is provided. At least a portion of a lead frame is plated, then a first heating of the plated portion of the lead frame to a first temperature is performed, and finally a second heating of the first heated plated portion of the lead frame to a second temperature higher than the first temperature is performed. The lead frame manufactured by this method has excellent anti-corrosion properties, such that deterioration of the plating layer, by cracking and inferior solderability, is not observed.
申请公布号 KR100243368(B1) 申请公布日期 2000.02.01
申请号 KR19960046829 申请日期 1996.10.18
申请人 SAMSUNG TECHWIN CO.,LTD. 发明人 KIM, JOONG DO;BAEK, YOUNG HO
分类号 H01L23/48;H01L21/44;H01L21/48;H01L21/50;H01L23/488;(IPC1-7):H01L23/488 主分类号 H01L23/48
代理机构 代理人
主权项
地址
您可能感兴趣的专利