发明名称 |
Method and system for introducing flux onto at least one surface of a solder pump |
摘要 |
A method and system for introducing flux onto at least one surface of a solder pump achieve their objects as follows. A solder pump nozzle is submerged into a flux reservoir. In response to such submersion, the flux in the reservoir is actively introduced into the solder pump nozzle. In one embodiment, the active introduction is achieved by creating a negative pressure in a solder pump nozzle such that flux fills a vacated volume. The created negative pressure is produced by moving a solder column, contained within the solder pump nozzle, under the influence of an applied electric current and an applied magnetic field.
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申请公布号 |
US6019275(A) |
申请公布日期 |
2000.02.01 |
申请号 |
US19980049172 |
申请日期 |
1998.03.27 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
AKIN, JAMES SHERILL;MENARD, EDWARD BLAKLEY;SCHIESSER, THOMAS ALAN;SMITH, TED MINTER |
分类号 |
B23K1/20;(IPC1-7):B23K31/02 |
主分类号 |
B23K1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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