| 摘要 |
1,198,569. Semi-conductor devices. R.C.A. CORPORATION. 17 June, 1968 [3 July, 1967], No. 28737/68. Heading H1K. A transistor is made by forming a diffused base region in a monocrystalline wafer, by remasking the wafer and exposing the desired emitter area, and then by forming a layer of doped polycrystalline semi-conductor and heating to diffuse impurities into the wafer to form the emitter region. An annular portion of the base region is exposed and metal contacts are applied to the exposed base and to the polycrystalline island over the emitter region. The transistor shown is a variant in which two (in practical cases up to 100) emitter regions 66 are resistively connected together. Again, the base region 63 is formed in the monocrystalline wafer 60; emitter regions 66 are formed by diffusion of impurities from the deposited polycrystalline semiconductor 65; resistive material 68 (for example, intrinsic polycrystalline semi-conductor) is provided on each of the polycrystalline emitter islands; a layer 69 of highly conductive polycrystalline semi-conductor is formed over the entire surface (process masking 62 is still present); the base contact area is exposed; and a metal base contact 71 and single metal emitter contact 72 are applied. The semiconductor wafer may be of silicon, germanium, gallium arsenide, or germanium-silicon alloys. In an all-silicon device, process masking may be of silicon oxide, silicon nitride or silicon oxynitride.
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