发明名称 |
MOLD FOR INJECTION MOLDING OF THERMOSETTING MATERIAL |
摘要 |
PROBLEM TO BE SOLVED: To prevent the generation of flash in a molded product caused by an ejector pin. SOLUTION: The through-hole 16 communicating with a cavity 14 is provided to the mold main body 11 of a mold for the injection molding of a thermosetting material so as to be formed into a conical shape so as to expand the opening part 16a on the side of the cavity 14 of the through-hole 16 toward the cavity 14. An ejector pin 19 for discharging a molded product is inserted into the through-hole 16 and the leading end part thereof is formed into an inverted tapered shape inclined toward the inside of the cavity. |
申请公布号 |
JP2000033636(A) |
申请公布日期 |
2000.02.02 |
申请号 |
JP19980200975 |
申请日期 |
1998.07.15 |
申请人 |
GE TOSHIBA SILICONES CO LTD |
发明人 |
TANUMA YOICHIRO |
分类号 |
B29C45/40;B29C45/43;B29K101/10;(IPC1-7):B29C45/40 |
主分类号 |
B29C45/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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