发明名称 MOLD FOR INJECTION MOLDING OF THERMOSETTING MATERIAL
摘要 PROBLEM TO BE SOLVED: To prevent the generation of flash in a molded product caused by an ejector pin. SOLUTION: The through-hole 16 communicating with a cavity 14 is provided to the mold main body 11 of a mold for the injection molding of a thermosetting material so as to be formed into a conical shape so as to expand the opening part 16a on the side of the cavity 14 of the through-hole 16 toward the cavity 14. An ejector pin 19 for discharging a molded product is inserted into the through-hole 16 and the leading end part thereof is formed into an inverted tapered shape inclined toward the inside of the cavity.
申请公布号 JP2000033636(A) 申请公布日期 2000.02.02
申请号 JP19980200975 申请日期 1998.07.15
申请人 GE TOSHIBA SILICONES CO LTD 发明人 TANUMA YOICHIRO
分类号 B29C45/40;B29C45/43;B29K101/10;(IPC1-7):B29C45/40 主分类号 B29C45/40
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