发明名称 |
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD |
摘要 |
A stacked bottom lead package for use in semiconductor devices includes leads that are bent along with the circumference of the body which has been premolded, wherein a chip is included inside the premolded body. The package configuration prevents solder fatigue of the lead due to heat carried via the extended lead and emitted out of the chip and decreases the area required for stacking semiconductor packages. |
申请公布号 |
KR100242393(B1) |
申请公布日期 |
2000.02.01 |
申请号 |
KR19970055467 |
申请日期 |
1997.10.28 |
申请人 |
HYUNDAI MICRO ELECTRONICS CO.,LTD. |
发明人 |
LEE, BYEONG DUCK;CHA, GI BON |
分类号 |
H01L23/48;H01L23/495;H01L25/10 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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