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发明名称
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
摘要
申请公布号
KR100243555(B1)
申请公布日期
2000.02.01
申请号
KR19920027592
申请日期
1992.12.31
申请人
SAMSUNG ELECTRONICS CO, LTD.
发明人
CHOI, JONG-GON;LIM, MIN-BIN
分类号
H01L21/60
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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