METHOD OF MAKING SMALL INCISIONS IN THIN METALLIC LAYERS DEPOSITED ON DIELECTRIC AND/OR SEMICONDUCTIVE SUBSTRATES,申请号PL19980327554-传众专利搜索

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发明名称	METHOD OF MAKING SMALL INCISIONS IN THIN METALLIC LAYERS DEPOSITED ON DIELECTRIC AND/OR SEMICONDUCTIVE SUBSTRATES
摘要
申请公布号	PL327554(A1)	申请公布日期	2000.01.31
申请号	PL19980327554	申请日期	1998.07.17
申请人	POLITECHNIKA WARSZAWSKA	发明人	LATUSZEK ANTONI
分类号	B23H9/00;(IPC1-7):B23H9/00	主分类号	B23H9/00
代理机构		代理人
主权项
地址

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