AN ELECTROPLATING METHOD OF FORMING PLATINGS OF NICKEL, COBALT, NICKEL ALLOYS OR COBALT ALLOYS

摘要

PCT No. PCT/DK96/00270 Sec. 371 Date Dec. 22, 1997 Sec. 102(e) Date Dec. 22, 1997 PCT Filed Jun. 20, 1996 PCT Pub. No. WO97/00980 PCT Pub. Date Jan. 9, 1997An electroplating method of forming platings of nickel, cobalt, nickel alloys or cobalt alloys with reduced stress in a Watts bath, a chloride bath or a combination thereof, by employing pulse plating with periodic reverse pulses and a sulfonated naphthalene additive. This method makes it possible to deposit nickel, cobalt, nickel alloy or cobalt alloy platings without internal stress.