发明名称 |
SLURRY SUPPLY SYSTEM FOR SEMICONDUCTOR CMP PROCESS |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a slurry supply system for semiconductor CMP process in which secondary particles of slurry are supplied to a CMP equipment while being dispersed into unit particles. SOLUTION: The slurry supply system for semiconductor CMP process supplies slurry 12 stored in a slurry storage tank 11 through a specified slurry supply line to a CMP equipment wherein the slurry supply line is provided with means 12 for transmitting ultrasonic wave to the slurry 12 in order to prevent unit particles of the slurry from being aggregated to secondary particles. Yield of wafer can be enhanced in the following steps by preventing formation of secondary particles due to aggregation of grinding particles in the slurry 12 thereby preventing fine scratch phenomenon on the surface of a wafer 14.</p> |
申请公布号 |
JP2000031100(A) |
申请公布日期 |
2000.01.28 |
申请号 |
JP19990159336 |
申请日期 |
1999.06.07 |
申请人 |
SAMSUNG ELECTRON CO LTD |
发明人 |
KIM SUE-RYEON;KIM SEUNG-UHN;DEN ZAIGO;KO SHIBUN |
分类号 |
B24B1/04;B24B37/00;B24B57/02;H01L21/00;H01L21/304;(IPC1-7):H01L21/304 |
主分类号 |
B24B1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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