TEMPERATURE MEASURING DEVICE OF WAFER OR THE LIKE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a temperature measuring device capable of detecting the temperature of a wafer or the like. SOLUTION: A recess 5A is provided in one side of a wafer 5 of quartz or the like, and through-holes 10 and 11 large enough in diameter to enable a pair of element wires 6 and 7 or lead wires 17 and 18 of a temperature measuring resistor 14 to be inserted into them are provided between the other side of the wafer 5 and the recess 5A. The through-holes 10 and 11 are so positioned that the element wires 6 and 7 or the lead wires 17 and 18 located outside are pulled outwards to make the temperature measuring junctions 12 located at the tips of the element wires 6 and 7 or the temperature measuring surface 14A of the temperature measuring resistor 14 bear against the inner surface 5a when the element wires 6 and 7 or the lead wires 17 and 18 are inserted into the through-holes 10 and 11, and in a state where the element wires 6 and 7 or the lead wires 17 and 18 are pulled outward, quartz powder 8 is filled into the recess 5A, and a covering 9 of quartz is mounted on the thicknesswise surface of the wafer 5.