| 摘要 |
PROBLEM TO BE SOLVED: To provide a board material for a printed circuit in which favorable electrical continuity is secured and the thermal expansion property can be controlled so that the board material and the conductive layer, and the insulating material and the metal wire do not peel off, respectively, and moreover which is made in higher density and is superior in dimensional accuracy. SOLUTION: This is the board material 10 for a printed circuit, where conductive metallic wires 12 are arranged at specified pitches at composite material 11 constituted of plastic and ceramics and made in the shape of a plate. One surface and the other surface of the board material 10 have electrical continuity by a metal wire 12. Hereby, favorable electrical continuity is secured, and also by controlling the thermal expansion property, the exfoliation between the board material and the conductive layer between and the insulating material and the metallic wire can be prevented at use.
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