SEMICONDUCTOR PACKAGE MEMBER AND MANUFACTURE OF IT

摘要

PROBLEM TO BE SOLVED: To provide a through hole continuity of high reliability while fine through hole machining and high-density wiring are possible. SOLUTION: A first process where an inter-layer insulating layer 4 which is to be a peripheral part of a filled through hole is patterned using electro-deposition polyimide, a second process where a part which is to fill a through hole is filled by plating, a third process where a circuit is formed to a plane comprising the inter-layer insulating layer 4 and the filled through hole, and a fourth process where an outside terminal 11 of land form is formed by etching, are provided to manufacture a semiconductor package member. Thus a fine through hole continuity with reliability is provided while high-density wiring is allowed.