| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed substrate of a structure in which an organic matter solder resist agent having adverse effects on high frequency property is not applied, that an oxide film is made for surface treatment of the pattern in the place requiring solder resist as its substitute, and that the oxide film has solder resist effect. SOLUTION: A conductive circuit pattern 2, where a component is to be mounted and soldered is made on a substrate 1 and a conductive plated layer 6 such as nickel or the like, is stacked on other conductive circuit part 5 provided in the vicinity of the conductive circuit pattern 2, and this conductive plated layer 6 is equipped with a solder resist where an oxide film 7 for impeding the wettability of the solder is made as a solder resist in the section on the side of the conductive circuit pattern 2.
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