| 摘要 |
PROBLEM TO BE SOLVED: To efficiently form a plurality of bumps on an electronic component is a simple and highly precise manner without giving damages on the electronic component. SOLUTION: An electrode pad 6, consisting of a ferromagnetic body is provided on the surface of an electronic component 5 in this bump forming method. The electrode pad 6 of the electronic component 5 is dipped into non-hardened conductive paste 4 which is formed by having fine powder of conductive material dispersed into a thermosetting resin, and when the electrode pad 6 is heated up by an electromagnetic induction heating device, the conductive paste 4 is hardened on the electrode pad 6, and a resin bump 7 is formed.
|
