| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a sensor film substrate, especially for mass flow sensor or pressure sensor, having a film stretched across the fringe part of an opening made in the front face of the film substrate from the back thereof by etching. SOLUTION: The inventive method comprises a step for preparing a substrate 10, i.e., a silicon wafer, a step for making the substrate 10 thick locally in a region L on the front face VS as compared with the fringe part R with the thick part making continuous transition to the substrate 10, a step for depositing a film layer 25 on the front face VS having a locally oxidized region L, and a step for making an opening 50 from the back face RS to a film 100 by etching such that the fringe part R is located beneath the thickened region L.
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